This project looks for motivated student(s) to work individually or as a group to develop labview code for a custom-made creep test system. The creep test system will be used to measure the response of novel lead-free solder alloys that are being developed for advanced microelectronics packaging technologies. The labview program will record the load/displacement/temperature during the test and generate stress-strain and strain-time plots. The code needs to allow testing under constant stress and constant displacement modes. The hardware components (actuator, motor, temperature controller, etc) are located in ENG1-388. Most of the development can be done off-site before the final integration and testing of the code. The student(s) will work under the supervision of the faculty advisor and a graduate student. The student(s) will have the opportunity to learn the latest technology in microelectronics packaging and gain industry exposure as the project is sponsored by an industrial collaborator. If publications in conferences or journals are generated from the system, the student(s) will also be included as co-authors.
Start Date: 1/11/2023 - End Date: 4/20/2023
Type of Project
The student is responsible for the development of functional labview program to control a custom-made creep test system. At the end of the project, it is expected that the program will be fully functioning with the desired functions and the code will be transferred to the PI. The student is expected to communicate with the graduate student and the faculty advisor in the duration of the project.
Self-motivated, team player, good communication skills. Some basic programming skills are needed. Labview experience is preferred. Knowledge on common mechanical testing is also preferred.
Interested in Working With the Following Programs
For EXCEL URE Students Only
If interested and want to learn more, feel free to contact Dr. Tengfei Jiang.