This project looks for motivated student(s) to assist in the development of novel Sn-Ag-Cu-Bi (SAC-Bi) alloys. SAC-Bi alloys are gaining popularity in recent years as a solder material because they have the potential to deliver better creep lifetime and lower assembly temperature for advanced packaging applications. In this project, the student(s) will work directly with a graduate student and under the supervision of the faculty member. Tasks involve assisting with basic lab duties, such as sample preparation, characterization, and data analysis. The lab is located in ENG1-388. The student(s) will have the opportunity to learn about basic materials characterization techniques, expose to the latest technology in microelectronics packaging, and gain industry exposure as the project is sponsored by an industrial collaborator. Publication opportunities are also available.
Start Date: 1/11/2023 - End Date: 4/20/2023
Type of Project
The student is responsible for carrying out the tasks assigned by the graduate student and the PI. Examples of these tasks are: provide a CAD drawing and get a part machined by the machine shop; polishing samples (after being trained), materials characterization (for example, under optical microscope), and data analysis (for example, extract data from a measurement, plot data, etc). The student will directly work with a graduate student and receive the necessary training and guidance.
Self-motivated, team player, good communication skills. It is preferable that the student has taken EGN 3365 or equivalent. Matlab, LabView, and CAD skills are preferred but not required.
Interested in Working With the Following Programs
For EXCEL URE Students Only
Payment may be possible.